Comments on: Is 2D Scaling Really Dead or Just Mostly Dead? http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/ sharing insights into the people side of ASIC design Thu, 17 May 2012 16:25:51 +0000 http://wordpress.org/?v=2.3.2 By: Frank Scanlon http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-2575 Frank Scanlon Fri, 11 Feb 2011 19:28:18 +0000 http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-2575 Hello Harry, For the Silicon On Insulator (SOI) wafer fabrication process, do you think it will require the wafer to be held in place by an electrostatic chuck? I'm not familiar with the SOI process. Thanks! Hello Harry,

For the Silicon On Insulator (SOI) wafer fabrication process,
do you think it will require the wafer to be held in place by an electrostatic
chuck? I’m not familiar with the SOI process. Thanks!

]]> By: Dan Holden http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-1985 Dan Holden Wed, 23 Jun 2010 17:36:10 +0000 http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-1985 Harry, Nice write-up. Not sure that any current technology is capable of 4nm, in fact it's highly doubtful. Semiconductor manufacturing considers several additional factors when choosing a new technology, including yield and throughput. If the yield is not sufficiently high, the technology isn't ready. In addition, the throughput of each new lithography system has to be better than the last generation. That's why it took so long for immersion lithography to come on line, and that's why direct write is a huge question mark. Simply put, to support Moore's Law, it has to be able to write twice as many circuits twice as fast, or it can't compete. Harry, Nice write-up. Not sure that any current technology is capable of 4nm, in fact it’s highly doubtful. Semiconductor manufacturing considers several additional factors when choosing a new technology, including yield and throughput. If the yield is not sufficiently high, the technology isn’t ready. In addition, the throughput of each new lithography system has to be better than the last generation. That’s why it took so long for immersion lithography to come on line, and that’s why direct write is a huge question mark. Simply put, to support Moore’s Law, it has to be able to write twice as many circuits twice as fast, or it can’t compete.

]]> By: harry http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-1973 harry Tue, 22 Jun 2010 00:18:34 +0000 http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-1973 Richard - I'm sure you are right. At the risk of dating myself as well, my first experience with e-beam was ~1989 at 0.5uM. Motorola got the first e-beam machine that the Japanese would export to the US. Richard - I’m sure you are right. At the risk of dating myself as well, my first experience with e-beam was ~1989 at 0.5uM. Motorola got the first e-beam machine that the Japanese would export to the US.

]]> By: Richard Goering http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-1972 Richard Goering Tue, 22 Jun 2010 00:11:08 +0000 http://theasicguy.com/2010/06/20/is-2d-scaling-really-dead-or-just-mostly-dead/#comment-1972 Harry -- e-beam lithography has been talked about for lot longer than the 1990's. At the risk of dating myself, I remember writing about it in the mid-1970s, just out of college. As of today it looks like a good technology for small to medium volumes, provided the number of writes can be reduced. For example, write an E as one character rather than four separate lines. A company called D2S is working on "design for ebeam" technology with that in mind. Harry — e-beam lithography has been talked about for lot longer than the 1990’s. At the risk of dating myself, I remember writing about it in the mid-1970s, just out of college. As of today it looks like a good technology for small to medium volumes, provided the number of writes can be reduced. For example, write an E as one character rather than four separate lines. A company called D2S is working on “design for ebeam” technology with that in mind.

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